Many applications have in common that they demand joint integration of planar two-dimensional (2D) building blocks with three-dimensional (3D) objects such as photonic wire bonds, microlenses, or blazed gratings.
3D lithography based on two-photon absorption shows promising perspectives to enable such configurations, thereby serving applications in areas ranging from photonic communications and teratronics to optical metrology and large-scale biosensing.
Photonic Multi-Chip Integration
Our multi-chip concept bases on photonic wire bonds that are used to connect integrated photonic circuits across chip boundaries.
The concept exploits direct-write multi-photon lithography for in-situ fabrication of three-dimensional freeform waveguides, thereby making high-precision alignment of the optical chips obsolete.
2015-09-17 KIT – University of the State of Baden-Wuerttemberg and National Laboratory of the Helmholtz Association