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PILOT-3D CONTACT

Karlsruhe Institute of Technology
Institute of Microstructure Technology

Hermann-von-Helmholtz-Platz 1
76344 Eggenstein-Leopoldshafen
Germany

Tel.: +49 721 608 26840 (IMT)
Tel.: +49 721 608 47173 (IPQ)
Fax: +49 721 608 28848

E-Mail: infoIkf5∂pilot-3d de
Web:   www.pilot-3d.de

Christian Koos
+49 721 608-42491 (IPQ)/+49 721 608-22770 (IMT)
Christian KoosZuu4∂kit edu
Philipp Dietrich
+49 721 608-26840 (IMT) / +49 721 608-47173 (IPQ)
p-i dietrichLhf2∂kit edu


Publications


List publications according to year

All | 2017 | 2016 | 2015 | 2014 | 2013 | 2012 | 2011

List publications according to type

All | Journal Articles | Conference Contributions | Lectures

Journal Articles (4)

  • Goering, G.; Dietrich, P.-I.; Blaicher, M.; Sharma, S.; Korvink, J.; Schimmel, T.; Koos, C.; Hoelscher, H.
    Tailored probes for atomic force microscopy fabricated by two-photon polymerization
    Applied Physics Letters 109, 063101 (2016) [DOI]

  • Schneider, S.; Lauermann, M.; Dietrich, P.-I.; Weimann, C.; Freude, W.; Koos, C.
    Optical coherence tomography system mass-producible on a silicon photonic chip
    Opt. Express 24, 1573-1586 (2016) [DOI]

  • Lindenmann, N.; Dottermusch, S.; Goedecke, M. L.; Hoose, T.; Billah, M. R.; Onanuga, T.; Hofmann, A.; Freude, W.; Koos, C.
    Connecting Silicon Photonic Circuits to Multi-Core Fibers by Photonic Wire Bonding
    J. Lightwave Technol. 33, 755 - 760 (2015) [DOI] more, (invited)

  • Lindenmann, N.; Balthasar, G.; Hillerkuss, D.; Schmogrow, R.; Jordan, M.; Leuthold, J.; Freude, W.; Koos, C.
    Photonic wire bonding: a novel concept for chip-scale interconnects
    Opt. Express 20, 17667--17677 (2012) [DOI]


Conference Contributions (20)

  • Billah, M. R.; Blaicher, M.; Kemal, J. N.; Hoose, T.; Zwickel, H.; Dietrich, P.-I.; Troppenz, U.; Moehrle, M.; Merget, F.; Hofmann, A.; Witzens, J.; Randel, S.; Freude, W.; Koos, C.
    8-channel 448 Gbit/s Silicon Photonic Transmitter Enabled by Photonic Wire Bonding
    Optical Fiber Communication Conference (OFC'17), Los Angeles (CA), USA, March 19–23 , paper Th5D.6. (2017) [DOI] (postdeadline)

  • Nesic, A.; Blaicher, M.; Hoose, T.; Lauermann, M.; Kutuvantavida, Y.; Freude, W.; Koos, C.
    Hybrid 2D/3D photonic integration for non-planar circuit topologies
    42th European Conf. Opt. Commun. (ECOC'16), Düsseldorf, Germany, Sept. 18–22 (2016) more

  • Dietrich, P.-I.; Reuter, I.; Blaicher, M.; Schneider, S.; Billah, M. R.; Hoose, T.; Hofmann, A.; Caer, C.; Dangel, R.; Offrein, B.; Moehrle, M.; Troppenz, U.; Zander, M.; Freude, W.; Koos, C.
    Lenses for Low-Loss Chip-to-Fiber and Fiber-to-Fiber Coupling Fabricated by 3D Direct-Write Lithography
    Conf. on Lasers and Electro-Optics (CLEO'16), San Jose (CA), USA, June 5 – 10 , paper SM1G.4. (2016) [DOI]

  • Koos, C.; Freude, W.; Leuthold, J.; Dalton, L. R.; Wolf, S.; Zwickel, H.; Hoose, T.; Billah, M. R.; Lauermann, M.; Weimann, C.; Hartmann, W.; Melikyan, A.; Lindenmann, N.; Koeber, S.; Palmer, R.; Alloatti, L.; Giesecke, A. L.; Wahlbrink, T.
    Silicon-organic hybrid (SOH) integration and photonic multi-chip systems: Technologies for high-speed optical interconnects
    Optical Interconnects Conference (OI'16), Hyatt Regency Mission Bay Spa & Marina, San Diego, California, USA, May 9-11 (2016) [DOI] (invited)

  • Hoose, T.; Billah, M. R.; Marin-Palomo, P.; Blaicher, M.; Dietrich, P.-I.; Hofmann, A.; Troppenz, U.; Moehrle, M.; Lindenmann, N.; Thiel, M.; Simon, P.; Hoffmann, J.; Goedecke, M. L.; Freude, W.; Koos, C.
    Multi-Chip Integration by Photonic Wire Bonding: Connecting Surface and Edge Emitting Lasers to Silicon Chips
    Optical Fiber Communication Conference (OFC'16), Anaheim (CA), USA, March 20–24 , paper M2I.7 (2016) [DOI]

  • Mai, C.; Lischke, S.; Kroh, M.; Hoose, T.; Lindenmann, N.; Koos, C.; Mai, A.; Zimmermann, L.
    Optische Schnittstelle für photonische Wirebonds in photonischer BiCMOS-Technologie
    MikroSystemTechnik-Kongress 2015, Karlsruhe, Germany, Oct. 26–28 (2015) more

  • Dietrich, P.-I.; Wondimu, S. F.; Wienhold, T.; Steidle, M.; Hofmann, A.; Lindenmann, N.; Billah, M. R.; Hoose, T.; Blaicher, M.; Freude, W.; Koos, C.
    Herstellung mikrooptischer Komponenten durch Zwei-Photonen-Polymerisation
    MikroSystemTechnik-Kongress 2015, Karlsruhe, Germany, Oct. 26–28 , EDAS Paper-ID 1570106799 (2015) more

  • Billah, M. R.; Hoose, T.; Onanuga, T.; Lindenmann, N.; Dietrich, P.-I.; Wingert, T.; Goedecke, M. L.; Hofmann, A.; Troppenz, U.; Sigmund, A.; Moehrle, M.; Freude, W.; Koos, C.
    Multi-Chip Integration of Lasers and Silicon Photonics by Photonic Wire Bonding
    Conf. on Lasers and Electro-Optics (CLEO'15), San Jose (CA), USA, May 10–15 , paper STu2F.2. Optical Society of America (OSA) (2015) [DOI]

  • Nesic, A.; Palmer, R.; Koeber, S.; Korn, D.; Koenig, S.; Elder, D. L.; Dalton, L. R.; Freude, W.; Koos, C.
    Demonstration of Difference Frequency Generation in a Silicon Slot Waveguide
    Conf. on Lasers and Electro-Optics (CLEO'14), San Jose (CA), USA, June 8–13 , STh1I.2 Optical Society of America (2014) [DOI]

  • Lindenmann, N.; Dottermusch, S.; Hoose, T.; Billah, M. R.; Koeber, S.; Freude, W.; Koos, C.
    Connecting silicon photonic circuits to multi-core fibers by photonic wire bonding
    Optical Interconnects Conference (OI'14), Loews Coronado Bay, Coronado, California, USA, , 131-132 IEEE, May 4-7 (2014) [DOI]

  • Koos, C.; Freude, W.; Lindenmann, N.; Koeber, S.; Hoose, T.; Billah, M. R.
    Three-dimensional two-photon lithography: an enabling technology for photonic wire bonding and multi-chip integration
    SPIE 8970 (LASE-SPIE'14), Laser 3D Manufacturing, March , 897008-897008-10 (2014) [DOI] (invited)

  • Lindenmann, N.; Hoose, T.; Steenhusen, S.; Billah, M. R.; Koeber, S.; Houbertz-Krauss, R.; Koos, C.
    Photonic wire bonding as an enabling technology for multi-chip photonic system
    OPTO SPIE Photonics West (OPTO-SPIE'14) , 8991-5, San Francisco (CA), USA, Feb. 1-6 (2014)

  • Koos, C.; Freude, W.; Leuthold, J.; Alloatti, L.; Palmer, R.; Korn, D.; Pfeifle, J.; Schindler, P. C.; Lauermann, M.; Lindenmann, N.; Koeber, S.; Hoose, T.; Billah, M. R.; Yu, H.; Bogaerts, W.; Baets, R.; Fournier, M.; Fedeli, J.-M.; Dinu, R.; Bolten, J.; Wahlbrink, T.; Waldow, M.
    Silicon-organic hybrid integration and photonic wire bonding: Enabling technologies for heterogeneous photonic systems
    Frontiers in Optics (FiO'13), Orlando (FL), USA, October 05–10 , paper FTu1E.3 Optical Society of America (OSA) (2013) [DOI] (invited)

  • Koos, C.; Freude, W.; Leuthold, J.; Alloatti, L.; Palmer, R.; Korn, D.; Pfeifle, J.; Schindler, P. C.; Lauermann, M.; Nesic, A.; Lindenmann, N.; Koeber, S.; Hoose, T.; Billah, M. R.
    Silicon-organic hybrid (SOH) integration, photonic wire bonding, and frequency combs: Technologies for multi-terabit/s interconnects
    International Nano-Optoelectronics Workshop iNOW-2013, Cargèse, France, August 19-30 (2013) (invited)

  • Koos, C.; Freude, W.; Leuthold, J.; Lindenmann, N.; Koeber, S.; Hoffmann, J.; Hoose, T.; Hubner, P.; Billah, M. R.
    Photonic wire bonding: An enabling technology for heterogeneous multi-chip integration
    Advanced Photonics 2013: Integrated Photonics Research, Silicon and Nanophotonics (IPR'13), July 14–17 , paper IM4A.3 Optical Society of America (OSA), Rio Grande, Puerto Rico, USA (2013) [DOI] (invited)

  • Koos, C.; Leuthold, J.; Freude, W.; Lindenmann, N.; Koeber, S.; Hoffmann, J.; Hoose, T.; Hubner, P.
    Photonic wire bonding: Nanophotonic interconnects fabricated by direct-write 3D lithography
    15th International Conference on Transparent Optical Networks (ICTON), 2013, June 23-27 , paper We.C2.4, Cartagena, Spain, June (2013) [DOI] (invited)

  • Koos, C.; Leuthold, J.; Freude, W.; Alloatti, L.; Korn, D.; Palmer, R.; Lauermann, M.; Pfeifle, J.; Lindenmann, N.; Koeber, S.; Hillerkuss, D.; Schmogrow, R.
    Silicon photonics, hybrid integration and photonic wire bonding – enablers for energy-efficient terabit/s interconnects
    13th FIBER OPTICS EXPO Technical Conference, Tokyo, Japan, April 10-12 (2013) (invited)

  • Lindenmann, N.; Balthasar, G.; Leuthold, J.; Freude, W.; Koos, C.
    Broadband low-loss interconnects enabled by photonic wire bonding
    Optical Interconnects Conference (OI'12), Santa Fe, New Mexico, USA, May 20-23 , 125-126, Paper WC1 IEEE, May (2012) [DOI] (invited)

  • Lindenmann, N.; Balthasar, G.; Jordan, M.; Hillerkuss, D.; Schmogrow, R.; Freude, W.; Leuthold, J.; Koos, C.
    Low-Loss Photonic Wire Bond Interconnects Enabling 5 TBit/s Data Transmission
    Optical Fiber Communication Conference (OFC'12), Los Angeles (CA), USA, 2012, March 06-10 , paper OW4I.4 Optical Society of America (OSA) (2012) [DOI]

  • Lindenmann, N.; Kaiser, I.; Balthasar, G.; Bonk, R.; Hillerkuss, D.; Freude, W.; Leuthold, J.; Koos, C.
    Photonic Waveguide Bonds - A Novel Concept for Chip-to-Chip Interconnects
    Optical Fiber Communication Conference/National Fiber Optic Engineers Conference 2011 , paper PDPC1 Optical Society of America (2011) [DOI]

Lectures (1)

  • Koos, C.
    Photonic wire bonding, multi-chip integration, and wafer-level micro-optics enabled by 3D laser lithography
    Sino-German Workshop on Photonic Manufacturing, Manipulation and Measurement (PMMM2015), July 2-7, Changchun, China (2015) (invited)